# Signal and Power Integrity - Simplified

3rd Edition## Eric Bogatin

Jan 2018, Hardback, 992 pagesISBN13: 9780134513416

ISBN10: 013451341X

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## Description

- Table of Contents
- Features
- Author

**The #1 Practical Guide to Signal Integrity Design—with Revised Content and New Questions and Problems!**This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, world-renowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on high-speed serial links, reflecting input from 130+ of his graduate students.

• A fully up-to-date introduction to signal integrity and physical design

• New questions and problems designed for both students and professional engineers

• How design and technology selection can make or break power distribution network performance

• Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance

• Practical techniques for analyzing resistance, capacitance, inductance, and impedance

• Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances

• Identifying reflections and crosstalk with free animation tools

• Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement

• Understanding how interconnect physical design impacts signal integrity

• Managing differential pairs and losses

• Harnessing the full power of S-parameters in high-speed serial link applications

• Designing high-speed serial links associated with differential pairs and lossy lines—including new coverage of eye diagrams

• Ensuring power integrity throughout the entire power distribution path

• Realistic design guidelines for improving signal integrity, and much more

For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs right—first time, every time.

- Description
## Table of Contents

- Features
- Author

*Preface to the Third Edition xixPreface to the Second Edition xxiPreface to the First Edition xxiii*

**Chapter 1 Signal Integrity Is in Your Future 1**

1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility? 3

1.2 Signal-Integrity Effects on One Net 7

1.3 Cross Talk 11

1.4 Rail-Collapse Noise 14

1.5 Electromagnetic Interference (EMI) 17

1.6 Two Important Signal-Integrity Generalizations 19

1.7 Trends in Electronic Products 20

1.8 The Need for a New Design Methodology 26

1.9 A New Product Design Methodology 27

1.10 Simulations 29

1.11 Modeling and Models 34

1.12 Creating Circuit Models from Calculation 36

1.13 Three Types of Measurements 42

1.14 The Role of Measurements 45

1.15 The Bottom Line 48

Review Questions 50

**Chapter 2 Time and Frequency Domains 51**

2.1 The Time Domain 52

2.2 Sine Waves in the Frequency Domain 54

2.3 Shorter Time to a Solution in the Frequency Domain 56

2.4 Sine-Wave Features 58

2.5 The Fourier Transform 60

2.6 The Spectrum of a Repetitive Signal 62

2.7 The Spectrum of an Ideal Square Wave 64

2.8 From the Frequency Domain to the Time Domain 66

2.9 Effect of Bandwidth on Rise Time 68

2.10 Bandwidth and Rise Time 72

2.11 What Does Significant Mean? 73

2.12 Bandwidth of Real Signals 77

2.13 Bandwidth and Clock Frequency 78

2.14 Bandwidth of a Measurement 80

2.15 Bandwidth of a Model 83

2.16 Bandwidth of an Interconnect 85

2.17 The Bottom Line 89

Review Questions 90

**Chapter 3 Impedance and Electrical Models 93**

3.1 Describing Signal-Integrity Solutions in Terms of Impedance 94

3.2 What Is Impedance? 97

3.3 Real Versus Ideal Circuit Elements 99

3.4 Impedance of an Ideal Resistor in the Time Domain 102

3.5 Impedance of an Ideal Capacitor in the Time Domain 103

3.6 Impedance of an Ideal Inductor in the Time Domain 107

3.7 Impedance in the Frequency Domain 109

3.8 Equivalent Electrical Circuit Models 115

3.9 Circuit Theory and SPICE 117

3.10 Introduction to Measurement-Based Modeling 121

3.11 The Bottom Line 126

Review Questions 128

**Chapter 4 The Physical Basis of Resistance 131**

4.1 Translating Physical Design into Electrical Performance 132

4.2 The Only Good Approximation for the Resistance of Interconnects 133

4.3 Bulk Resistivity 136

4.4 Resistance per Length 138

4.5 Sheet Resistance 139

4.6 The Bottom Line 143

Review Questions 145

**Chapter 5 The Physical Basis of Capacitance 147**

5.1 Current Flow in Capacitors 149

5.2 The Capacitance of a Sphere 150

5.3 Parallel Plate Approximation 152

5.4 Dielectric Constant 153

5.5 Power and Ground Planes and Decoupling Capacitance 156

5.6 Capacitance per Length 159

5.7 2D Field Solvers 165

5.8 Effective Dielectric Constant 168

5.9 The Bottom Line 172

Review Questions 173

**Chapter 6 The Physical Basis of Inductance 175**

6.1 What Is Inductance? 175

6.2 Inductance Principle 1: There Are Circular Rings of Magnetic-Field Lines Around All Currents 176

6.3 Inductance Principle 2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It 179

6.4 Self-Inductance and Mutual Inductance 181

6.5 Inductance Principle 3: When the Number of Field Line Rings Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor 184

6.6 Partial Inductance 187

6.7 Effective, Total, or Net Inductance and Ground Bounce 193

6.8 Loop Self- and Mutual Inductance 199

6.9 The Power Distribution Network (PDN) and Loop Inductance 204

6.10 Loop Inductance per Square of Planes 210

6.11 Loop Inductance of Planes and Via Contacts 211

6.12 Loop Inductance of Planes with a Field of Clearance Holes 214

6.13 Loop Mutual Inductance 216

6.14 Equivalent Inductance of Multiple Inductors 216

6.15 Summary of Inductance 219

6.16 Current Distributions and Skin Depth 220

6.17 High-Permeability Materials 229

6.18 Eddy Currents 232

6.19 The Bottom Line 235

Review Questions 237

**Chapter 7 The Physical Basis of Transmission Lines 239**

7.1 Forget the Word Ground 240

7.2 The Signal 242

7.3 Uniform Transmission Lines 243

7.4 The Speed of Electrons in Copper 245

7.5 The Speed of a Signal in a Transmission Line 247

7.6 Spatial Extent of the Leading Edge 251

7.7 “Be the Signal” 252

7.8 The Instantaneous Impedance of a Transmission Line 256

7.9 Characteristic Impedance and Controlled Impedance 259

7.10 Famous Characteristic Impedances 262

7.11 The Impedance of a Transmission Line 266

7.12 Driving a Transmission Line 271

7.13 Return Paths 274

7.14 When Return Paths Switch Reference Planes 278

7.15 A First-Order Model of a Transmission Line 291

7.16 Calculating Characteristic Impedance with Approximations 297

7.17 Calculating the Characteristic Impedance with a 2D Field Solver 300

7.18 An n-Section Lumped-Circuit Model 306

7.19 Frequency Variation of the Characteristic Impedance 314

7.20 The Bottom Line 316

Review Questions 318

**Chapter 8 Transmission Lines and Reflections 321**

8.1 Reflections at Impedance Changes 323

8.2 Why Are There Reflections? 324

8.3 Reflections from Resistive Loads 328

8.4 Source Impedance 331

8.5 Bounce Diagrams 333

8.6 Simulating Reflected Waveforms 335

8.7 Measuring Reflections with a TDR 337

8.8 Transmission Lines and Unintentional Discontinuities 340

8.9 When to Terminate 343

8.10 The Most Common Termination Strategy for Point-to-Point Topology 345

8.11 Reflections from Short Series Transmission Lines 348

8.12 Reflections from Short-Stub Transmission Lines 351

8.13 Reflections from Capacitive End Terminations 353

8.14 Reflections from Capacitive Loads in the Middle of a Trace 356

8.15 Capacitive Delay Adders 359

8.16 Effects of Corners and Vias 361

8.17 Loaded Lines 367

8.18 Reflections from Inductive Discontinuities 370

8.19 Compensation 375

8.20 The Bottom Line 377

Review Questions 379

**Chapter 9 Lossy Lines, Rise-Time Degradation, and Material Properties 381**

9.1 Why Worry About Lossy Lines? 382

9.2 Losses in Transmission Lines 385

9.3 Sources of Loss: Conductor Resistance and Skin Depth 387

9.4 Sources of Loss: The Dielectric 392

9.5 Dissipation Factor 396

9.6 The Real Meaning of Dissipation Factor 399

9.7 Modeling Lossy Transmission Lines 405

9.8 Characteristic Impedance of a Lossy Transmission Line 413

9.9 Signal Velocity in a Lossy Transmission Line 415

9.10 Attenuation and dB 417

9.11 Attenuation in Lossy Lines 423

9.12 Measured Properties of a Lossy Line in the Frequency Domain 433

9.13 The Bandwidth of an Interconnect 438

9.14 Time-Domain Behavior of Lossy Lines 445

9.15 Improving the Eye Diagram of a Transmission Line 448

9.16 How Much Attenuation Is Too Much? 450

9.17 The Bottom Line 452

Review Questions 454

**Chapter 10 Cross Talk in Transmission Lines 457**

10.1 Superposition 459

10.2 Origin of Coupling: Capacitance and Inductance 460

10.3 Cross Talk in Transmission Lines: NEXT and FEXT 462

10.4 Describing Cross Talk 464

10.5 The SPICE Capacitance Matrix 467

10.6 The Maxwell Capacitance Matrix and 2D Field Solvers 471

10.7 The Inductance Matrix 478

10.8 Cross Talk in Uniform Transmission Lines and Saturation Length 479

10.9 Capacitively Coupled Currents 485

10.10 Inductively Coupled Currents 489

10.11 Near-End Cross Talk 492

10.12 Far-End Cross Talk 496

10.13 Decreasing Far-End Cross Talk 503

10.14 Simulating Cross Talk 505

10.15 Guard Traces 512

10.16 Cross Talk and Dielectric Constant 519

10.17 Cross Talk and Timing 521

10.18 Switching Noise 524

10.19 Summary of Reducing Cross Talk 528

10.20 The Bottom Line 528

Review Questions 530

**Chapter 11 Differential Pairs and Differential Impedance 533**

11.1 Differential Signaling 534

11.2 A Differential Pair 538

11.3 Differential Impedance with No Coupling 541

11.4 The Impact from Coupling 545

11.5 Calculating Differential Impedance 552

11.6 The Return-Current Distribution in a Differential Pair 555

11.7 Odd and Even Modes 561

11.8 Differential Impedance and Odd-Mode Impedance 566

11.9 Common Impedance and Even-Mode Impedance 567

11.10 Differential and Common Signals and Odd- and Even-Mode Voltage Components 570

11.11 Velocity of Each Mode and Far-End Cross Talk 573

11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair 579

11.13 Measuring Even- and Odd-Mode Impedance 580

11.14 Terminating Differential and Common Signals 583

11.15 Conversion of Differential to Common Signals 590

11.16 EMI and Common Signals 595

11.17 Cross Talk in Differential Pairs 601

11.18 Crossing a Gap in the Return Path 604

11.19 To Tightly Couple or Not to Tightly Couple 607

11.20 Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements 608

11.21 The Characteristic Impedance Matrix 612

11.22 The Bottom Line 615

Review Questions 617

**Chapter 12 S-Parameters for Signal-Integrity Applications 619**

12.1 S-Parameters, the New Universal Metric 619

12.2 What Are S-Parameters? 621

12.3 Basic S-Parameter Formalism 623

12.4 S-Parameter Matrix Elements 627

12.5 Introducing the Return and Insertion Loss 631

12.6 A Transparent Interconnect 636

12.7 Changing the Port Impedance 639

12.8 The Phase of S21 for a Uniform 50-Ohm Transmission Line 641

12.9 The Magnitude of S21 for a Uniform Transmission Line 644

12.10 Coupling to Other Transmission Lines 649

12.11 Insertion Loss for Non-50-Ohm Transmission Lines 655

12.12 Data-Mining S-Parameters 661

12.13 Single-Ended and Differential S-Parameters 663

12.14 Differential Insertion Loss 668

12.15 The Mode Conversion Terms 672

12.16 Converting to Mixed-Mode S-Parameters 675

12.17 Time and Frequency Domains 676

12.18 The Bottom Line 681

Review Questions 683

**Chapter 13 The Power Distribution Network (PDN) 685**

13.1 The Problem 686

13.2 The Root Cause 688

13.3 The Most Important Design Guidelines for the PDN 690

13.4 Establishing the Target Impedance Is Hard 691

13.5 Every Product Has a Unique PDN Requirement 700

13.6 Engineering the PDN 701

13.7 The VRM 703

13.8 Simulating Impedance with SPICE 706

13.9 On-Die Capacitance 707

13.10 The Package Barrier 710

13.11 The PDN with No Decoupling Capacitors 715

13.12 The MLCC Capacitor 717

13.13 The Equivalent Series Inductance 721

13.14 Approximating Loop Inductance 724

13.15 Optimizing the Mounting of Capacitors 733

13.16 Combining Capacitors in Parallel 740

13.17 Engineering a Reduced Parallel Resonant Peak by Adding More Capacitors 746

13.18 Selecting Capacitor Values 748

13.19 Estimating the Number of Capacitors Needed 754

13.20 How Much Does a nH Cost? 756

13.21 Quantity or Specific Values? 760

13.22 Sculpting the Impedance Profiles: The Frequency-Domain Target Impedance Method (FDTIM) 766

13.23 When Every pH Counts 772

13.24 Location, Location, Location 777

13.25 When Spreading Inductance Is the Limitation 781

13.26 The Chip View 785

13.27 Bringing It All Together 789

13.28 The Bottom Line 792

Review Questions 794

**Appendix A 100+ General Design Guidelines to Minimize Signal-Integrity Problems 797**

Appendix B 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects 805

Appendix C Selected References 815

Appendix D Review Questions and Answers 819

Index 931

Appendix B 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects 805

Appendix C Selected References 815

Appendix D Review Questions and Answers 819

Index 931

- Description
- Table of Contents
## Features

- Author

- Explains how to make design and technology decisions that ensure reliable power distribution network performance in tomorrow’s faster, smaller devices
- Emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor
- Includes new questions and problems designed to help students and professional engineers test and deepen their understanding
- Contains new coverage of using free tools such as QUCS to solve specific problems in signal integrity, power integrity, and electromagnetic compatibility

- Description
- Table of Contents
- Features
## Author

**Eric Bogatin** received his B.S. in Physics from MIT in 1976 and his M.S. and Ph.D. in Physics from the University of Arizona in Tucson in 1980. For more than 30 years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp, Sun Microsystems, Interconnect Devices Inc., and Teledyne LeCroy. In 2011, his company, Bogatin Enterprises, was acquired by Teledyne LeCroy.

Eric currently is a Signal Integrity Evangelist with Teledyne LeCroy, where he creates and presents educational materials related to new applications for high-performance scopes. Eric turns complexity into practical design and measurement principles, leveraging analysis techniques and measurement tools. Since 2012, he has been an adjunct professor at the University of Colorado in Boulder, teaching graduate courses in signal integrity, interconnect design, and PCB design.

He has written regular monthly columns for* PCD&F Magazine*, *Semiconductor International*, *Electronic Packaging and Production*, Altera Corporation, Mentor Graphics Corporation, *EDN*, and* EE Times*. He is currently the editor of the *Signal Integrity Journal* (www.SignalIntegrityJournal.com )

Eric is a prolific author with more than 300 publications, many posted on his website, www.beTheSignal.com, for download. He regularly presents at DesignCon, the IEEE EMC Symposium, EDI con, and at IPC’s Designer Council events. He is the coauthor of the popular Prentice Hall book, *Principles of Power Integrity for PDN Design - Simplified*, along with Larry Smith.

He was the recipient of the 2016 Engineer of the Year Award from DesignCon.

He can be reached at eric@beTheSignal.com.